A variety of solder paste, normal usage of lead-free solder paste

Lead free solder paste is a commonly used soldering material in modern electronic manufacturing, especially with the increasingly strict environmental regulations, lead-free solder paste has been widely used. The following is an overview of the normal usage methods of lead-free solder paste for Anhui Anye tin material:

1. * * Storage * *:

-Lead free solder paste should be stored in a dry and cool environment, avoiding high temperatures and humidity.

-Unopened solder paste should be stored in the refrigerator (usually at 2-8 ° C) to extend its shelf life.

2. * * Preparation * *:

-After removing the solder paste from the refrigerator, it is necessary to cool it down at room temperature for at least 4 hours to avoid the generation of moisture during printing.

-After reheating, the solder paste should be stirred using a centrifuge or manually for 1-2 minutes (or according to the recommended stirring time in the product manual) to ensure uniform composition.

3. * * Printing * *:

-Use appropriate steel mesh or template to print solder paste onto PCB (printed circuit board).

-Ensure that the printing machine is clean and there is an appropriate gap between the steel mesh and PCB to achieve good printing results.

4. * * Welding * *:

-Set the temperature of the reflow soldering furnace based on the characteristics of lead-free solder paste and the recommended soldering curve.

-Ensure uniform temperature during the welding process and avoid overheating or rapid cooling.

The following are the specific operational steps:

1. * * Temperature recovery * *:

-Remove the solder paste from the refrigerator and let it cool down at room temperature for at least 4 hours.

2. * * Mixing * *:

-After warming up, open the solder paste container and mix evenly using a blender or by hand.

3. * * Set printing parameters * *:

-Adjust the parameters of the printing machine, such as printing speed, pressure, and demolding speed.

4. * * Printed solder paste * *:

-Print solder paste evenly onto the PCB, taking care to avoid creating bubbles or excessive solder paste.

5. * * Check and correct * *:

-Check the printing quality and make necessary corrections if necessary.

6. * * Welding process * *:

-Place the printed solder paste PCB into the reflow soldering oven and solder it according to the predetermined soldering curve.

7. * * Cooling * *:

-After welding is completed, let the PCB cool naturally or use cooling equipment for rapid cooling.

8. * * Inspection * *:

-After welding is completed, inspect the welding quality to ensure that there are no defects such as virtual welding, cold welding, or soldering.

9. * * Post processing * *:

-If no cleaning solder paste is used, post-treatment is usually not required. But if necessary, appropriate cleaning should be carried out according to the recommendations of the solder paste manufacturer.

10. * * Store remaining solder paste * *:

-Unused solder paste should be resealed and stored in the refrigerator.

Please note that the above steps may be adjusted according to the specific solder paste model and usage environment. Before use, carefully read the lead-free solder paste user manual provided by Anhui Anye Tin Materials and follow its recommendations.

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